This week’s news feature covers Taiwan Semiconductor Manufacturing Company’s (TSMC) plans to expand across Europe and construct ten new facilities globally by 2025.
TSMC will include advanced packaging facilities in the U.S. and a 1nm fab in Taiwan. Meanwhile, Advanced Micro Devices (AMD) launches its new Ryzen AI PRO 300 Series processors, directly challenging Nvidia’s Blackwell AI chip. The semiconductor industry drives forward with bold advancements and competitive innovations.
Offering unprecedented AI compute capabilities and multi-day battery life. These developments highlight the competitive dynamics within the AI chip market as companies strive to meet the growing demand for high-performance computing solutions. Find out more below:
We hope you’ve found valuable information in the above article. A Focus on Technology: TSMC plans for expansion and new AI chip from AMD, tipped to rival NVIDIA’s Blackwell.
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Note: The above excerpts are sourced from three online articles as highlighted at the bottom of the document. Please refer to attached links for further information on the discussed topics.
